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Related Experiment Video

Updated: Jun 6, 2026

High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods
07:51

High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods

Published on: December 23, 2013

In-plane biocompatible microfluidic interconnects for implantable microsystems.

Dean G Johnson1, Robert D Frisina, David A Borkholder

  • 1Rochester Institute of Technology, Rochester, NY 14623, USA. dgj2607@rit.edu

IEEE Transactions on Bio-Medical Engineering
|December 15, 2010
PubMed
Summary

This study presents a novel method for connecting external fluidic systems to microfluidic channels in small animal models. The low-volume, high-pressure interconnects are ideal for implantable biomedical research applications.

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Related Experiment Videos

Last Updated: Jun 6, 2026

High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods
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Fabrication of Refractive-index-matched Devices for Biomedical Microfluidics

Published on: September 10, 2018

Area of Science:

  • Biomedical Engineering
  • Materials Science
  • Microfluidics

Background:

  • Small mammals like mice are crucial for biomedical research but pose challenges for implantable microsystems due to their small size.
  • Designing effective fluidic interconnects for these tiny models is a significant hurdle in developing advanced research tools.

Purpose of the Study:

  • To develop and characterize a novel, low-volume interconnect technology for coupling external fluidic systems to microfluidic channels in small animal models.
  • To optimize the design of these interconnects for high pressure resistance and minimal volume addition, crucial for biomedical implants.

Main Methods:

  • A method involving capillary tubing insertion into silicon wafer channels sealed with Parylene-C deposition was employed.
  • Knudsen diffusion and deposition characterizations were used to predict and optimize Parylene-C deposition into tapered channels.
  • Biocompatible and chemical-resistant materials were utilized for fabricating the interconnects.

Main Results:

  • Demonstrated low-volume interconnects with a volume of less than 0.018 mm³ (18 nL) per unit.
  • Interconnects showed high pressure resistance, withstanding up to 827 kPa (120 psi).
  • Achieved an average pull test strength of 2.9 N, indicating robust mechanical integrity.

Conclusions:

  • The developed interconnect technology is ideal for implantable medical applications where minimal volume is critical.
  • This innovation facilitates advanced microfluidic applications in small animal models for biomedical research.
  • The robust and low-volume nature of these interconnects addresses key design challenges in microsystem development for research.