Updated: Jun 5, 2026

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
Published on: March 20, 2015
Christoph Vannahme1, Sönke Klinkhammer, Mads Brøkner Christiansen
1Institute for Microstructure Technology, Karlsruhe Institute of Technology, 76128 Karlsruhe, Germany. christoph.vannahme@kit.edu
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