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Residue-Free Fabrication of van der Waals Heterostructures of Two-Dimensional Materials

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Stick-slip substructure in rapid tape peeling.

S T Thoroddsen¹, H D Nguyen, K Takehara

¹Division of Physical Sciences and Engineering, King Abdullah University of Science and Technology, Thuwal 23955-6900, Saudi Arabia.

Physical Review. E, Statistical, Nonlinear, and Soft Matter Physics

|January 15, 2011

Summary

High-speed tape peeling reveals a regular substructure of slip bands. These bands fracture sideways, emitting waves that generate the characteristic ripping sound observed during adhesive tape detachment.

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Area of Science:

Physics
Materials Science
Tribology

Background:

Adhesive tape peeling is known to involve stick-slip dynamics.
This process generates audible sound, light, and even X-rays under vacuum conditions.
Previous studies have correlated these emissions with slip events.

Purpose of the Study:

To directly image and characterize the substructure of the detachment zone during high-speed tape peeling.
To investigate the relationship between the observed substructure and the emitted sound.

Main Methods:

Direct imaging of the detachment zone during high-speed Scotch tape peeling from a solid surface.
Analysis of the substructure within the slip region.

Main Results:

A highly regular substructure was revealed in the detachment zone during the slip phase.
The typical 4-mm-long slip region exhibits transverse slip bands, each 220 μm wide.
These slip bands fracture sideways at peeling speeds exceeding 300 m/s.
The fracture tip emits waves at approximately 100 m/s into the detached tape, correlating with sound generation.

Conclusions:

High-speed tape peeling exhibits a regular, wave-emitting substructure.
This substructure and associated wave emission are key to the characteristic ripping sound.
The findings provide new insights into the physics of adhesive tape detachment and fracture dynamics.