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Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
Published on: March 20, 2015
Hirohito Yamada1, Michinao Nozawa, Masao Kinoshita
1Department of Electrical and Communication Engineering, Graduate School of Engineering, Tohoku University, Aoba-ku, Sendai, Japan. yamada@ecei.tohoku.ac.jp
We developed a grating coupler for efficient optical signal transmission between optical fibers and on-chip waveguides. This interface offers high coupling efficiency and tolerance for fiber misalignment, enabling advanced optical interconnections.
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