[Spectrum diagnostics for optimization of experimental parameters in thin films deposited by magnetron sputtering]

The plasma emission spectra generated during the deposition process of Si-based thin films by radio frequency (RF) magnetron sputtering using Cu and Al targets in an argon atmosphere were acquired by the plasma analysis system, which consists of a magnetron sputtering apparatus, an Omni-lambda300 series grating spectrometer, a CCD data acquisition system and an optical fiber transmission system. The variation in Cu and Al plasma emission spectra intensity depending on sputtering conditions, such as sputtering time, sputtering power, the target-to-substrate distance and deposition pressure, was studied by using the analysis lines Cu I 324. 754 nm, Cu I 327. 396 nm, Cu I 333. 784 nm, Cu I 353. 039 nm, Al I 394. 403 nm and Al I 396. 153 nm. Compared with the option of experimental parameters of thin films deposited by RF magnetron sputtering, it was shown that emission spectra analysis methods play a guiding role in optimizing the deposition conditions of thin films in RF magnetron sputtering.