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Updated: Jun 4, 2026

Accumulation and Analysis of Cuprous Ions in a Copper Sulfate Plating Solution
Published on: March 20, 2019
[Newly leaching method of copper from waste print circuit board using hydrochloric acid/n-butylamine/copper sulfate]
Hong-Yan Wang1, Zhao-Jie Cui, Ya-Wei Yao
1School of Environmental Science and Engineering, Shandong University, Ji'nan 250100, China. whywlw@126.com
Abstract:
A newly leaching method of copper from waste print circuit board was established by using hydrochloric acid-n-butylamine-copper sulfate mixed solution. The conditions of leaching were optimized by changing the hydrochloric acid, n-butylamine, copper sulfate,temperature and other conditions using copper as target mimics. The results indicated that copper could be leached completely after 8 h at 50 degrees C, hydrochloric acid concentration of 1.75 mol/L, n-butylamine concentration of 0.25 mol/L, and copper sulfate mass of 0.96 g. Under the conditions, copper leaching rates in waste print circuit board samples was up to 95.31% after 9 h. It has many advantages such as better effects, low cost, mild reaction conditions, leaching solution recycling.
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