Jove
Visualize
Contact Us
JoVE
x logofacebook logolinkedin logoyoutube logo
ABOUT JoVE
OverviewLeadershipBlogJoVE Help Center
AUTHORS
Publishing ProcessEditorial BoardScope & PoliciesPeer ReviewFAQSubmit
LIBRARIANS
TestimonialsSubscriptionsAccessResourcesLibrary Advisory BoardFAQ
RESEARCH
JoVE JournalMethods CollectionsJoVE Encyclopedia of ExperimentsArchive
EDUCATION
JoVE CoreJoVE BusinessJoVE Science EducationJoVE Lab ManualFaculty Resource CenterFaculty Site
Terms & Conditions of Use
Privacy Policy
Policies

Related Experiment Video

Updated: Jun 4, 2026

Fabrication of a Dipole-assisted Solid Phase Extraction Microchip for Trace Metal Analysis in Water Samples
09:42

Fabrication of a Dipole-assisted Solid Phase Extraction Microchip for Trace Metal Analysis in Water Samples

Published on: August 7, 2016

Atom chips on direct bonded copper substrates.

Matthew B Squires1, James A Stickney, Evan J Carlson

  • 1Air Force Research Laboratory, Hanscom AFB, Massachusetts 01731, USA.

The Review of Scientific Instruments
|March 3, 2011
PubMed
Summary
This summary is machine-generated.

Related Concept Videos

You might also read

Related Articles

Articles linked to this work by shared authors, journal, and citation graph.

Sort by
Same author

Bedside Neuromodulation of Persistent Pain and Allodynia with Caloric Vestibular Stimulation.

Biomedicines·2024
Same author

Two Singapore public healthcare AI applications for national screening programs and other examples.

Health care science·2024
Same author

Lessons learned from the hospital to home community care program in Singapore and the supporting AI multiple readmissions prediction model.

Health care science·2024
Same author

Tolerability of caloric vestibular stimulation in a persistent pain cohort.

Brain stimulation·2020
Same author

Fluctuations of consciousness, mood, and science: The interhemispheric switch and sticky switch models two decades on.

The Journal of comparative neurology·2020
Same author

Clean, robust alkali sources by intercalation within highly oriented pyrolytic graphite.

The Review of scientific instruments·2020
Same journal

Compressed multi-scale entropy and its application in mechanical fault diagnosis.

The Review of scientific instruments·2026
Same journal

Bidirectional drive and multi-resolution adjustment across frequency bands in inertial impact piezoelectric motors via multimodal resonant vibration.

The Review of scientific instruments·2026
Same journal

A magnetic field sensor based on flaky Terfenol-D material and dual fiber grating.

The Review of scientific instruments·2026
Same journal

A novel E-field eight-way cavity combiner for high-power S-band applications.

The Review of scientific instruments·2026
Same journal

Constant radius blade spring suspended bench for vibration isolation.

The Review of scientific instruments·2026
Same journal

Qualification of infrared optical fibers and emitters for a spectrometer for in situ planetary exploration: Results from the TRIS (TRansmission and Illumination System) project.

The Review of scientific instruments·2026
See all related articles

Direct bonded copper (DBC) enables rapid fabrication of high power atom chips. This method offers excellent adhesion, high purity, and 3D structures for efficient magnetic trapping of atoms.

Area of Science:

  • Physics
  • Quantum Science
  • Materials Science

Background:

  • Atom chips are crucial for quantum technologies and precision measurements.
  • Traditional fabrication methods can be complex and time-consuming.
  • Direct bonded copper (DBC) offers a promising alternative for advanced chip fabrication.

Purpose of the Study:

  • To demonstrate the utility of direct bonded copper (DBC) for fabricating high-power atom chips.
  • To explore the benefits and optimize the design of DBC atom chips for magnetic trapping applications.

Main Methods:

  • Utilized direct bonded copper (DBC) for atom chip fabrication.
  • Developed and presented two mask options and two etching methods for copper wire patterns.
  • Characterized thermal impedance using a high-current test chip.

More Related Videos

DNA Origami-Mediated Substrate Nanopatterning of Inorganic Structures for Sensing Applications
08:59

DNA Origami-Mediated Substrate Nanopatterning of Inorganic Structures for Sensing Applications

Published on: September 27, 2019

Fabrication and Validation of an Organ-on-chip System with Integrated Electrodes to Directly Quantify Transendothelial Electrical Resistance
10:51

Fabrication and Validation of an Organ-on-chip System with Integrated Electrodes to Directly Quantify Transendothelial Electrical Resistance

Published on: September 26, 2017

Related Experiment Videos

Last Updated: Jun 4, 2026

Fabrication of a Dipole-assisted Solid Phase Extraction Microchip for Trace Metal Analysis in Water Samples
09:42

Fabrication of a Dipole-assisted Solid Phase Extraction Microchip for Trace Metal Analysis in Water Samples

Published on: August 7, 2016

DNA Origami-Mediated Substrate Nanopatterning of Inorganic Structures for Sensing Applications
08:59

DNA Origami-Mediated Substrate Nanopatterning of Inorganic Structures for Sensing Applications

Published on: September 27, 2019

Fabrication and Validation of an Organ-on-chip System with Integrated Electrodes to Directly Quantify Transendothelial Electrical Resistance
10:51

Fabrication and Validation of an Organ-on-chip System with Integrated Electrodes to Directly Quantify Transendothelial Electrical Resistance

Published on: September 26, 2017

  • Assembled and tested a system with two DBC atom chips for magnetic trapping of ultracold atoms.
  • Main Results:

    • Achieved excellent copper/substrate adhesion, high purity, and thick copper layers (>100 μm).
    • Demonstrated rapid fabrication potential (<8 hours) and the creation of 3D atom chip structures.
    • Determined the optimal wire aspect ratio (height:width) of 0.84:1 for maximizing magnetic field gradient while managing power dissipation.
    • Successfully trapped laser-cooled Rubidium-87 atoms using the fabricated DBC atom chips.

    Conclusions:

    • Direct bonded copper (DBC) is a versatile and efficient method for fabricating high-power atom chips.
    • The optimized wire geometry enhances magnetic field gradient for improved atom trapping.
    • DBC technology facilitates the development of advanced quantum devices and experiments.