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Updated: Jun 3, 2026

Metal-Assisted Electrochemical Nanoimprinting of Porous and Solid Silicon Wafers
Published on: February 8, 2022
1Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, 1406 W Green Street, Urbana, IL 61801, USA. anilku2@illinois.edu
This study introduces a novel method for direct metal nanostructure patterning using embossed solid electrochemical stamps. This technique enables precise fabrication of nanoscale features for advanced applications.
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Published on: November 9, 2015
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