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Published on: October 25, 2017
Pattern-induced thermal unbinding of filaments
1LPMCN, Université Lyon 1, Villeurbane, France.
Abstract:
Substrate patterning is shown to be a convenient method to control the adhesion of filaments. The pattern not only permits a control of adhesion, it also leads to an unbinding transition at finite temperatures. The dimensionality of transverse fluctuations controls the continuity of the transition, and in some cases, re-entrant binding is observed as temperature is increased. Unbinding on patterns is found to be easier to observe than unbinding on flat substrates. Finally, experimental conditions under which unbinding could be observable are discussed.
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