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Gradient-based source and mask optimization in optical lithography.

Yao Peng1, Jinyu Zhang, Yan Wang

  • 1Institute of Microelectronics, Tsinghua University, Beijing, 100084 China. peng-y09@mails.tsinghua.edu.cn

IEEE Transactions on Image Processing : a Publication of the IEEE Signal Processing Society
|March 26, 2011
PubMed
Summary
This summary is machine-generated.

This study introduces an efficient source and mask optimization (SMO) method to enhance 193 nm lithography. The new framework improves image quality and depth of focus (DOF) for semiconductor manufacturing.

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Area of Science:

  • Semiconductor Manufacturing
  • Optical Lithography
  • Computational Lithography

Background:

  • Conventional 193 nm lithography faces limitations in extending its lifespan.
  • Source and Mask Optimization (SMO) is a computationally intensive but effective solution.
  • Existing SMO methods require further efficiency improvements.

Purpose of the Study:

  • To develop a highly effective and efficient Source and Mask Optimization (SMO) framework.
  • To improve upon existing mask optimization techniques.
  • To enhance image fidelity and increase the depth of focus (DOF) in lithography.

Main Methods:

  • An integrated SMO framework combining novel source and improved mask optimization.
  • Utilizing pixel-based source and mask representations with objective function gradients for optimization.
  • Incorporating additional penalties in the objective function to boost DOF and regularize patterns.
  • Implementing an alternative optimization sequence for source and mask patterns.

Main Results:

  • Achieved convergence in just two to three iteration cycles.
  • Demonstrated significant improvements in image quality and DOF for 45 nm critical dimension patterns (contact holes and cross gate).
  • Verified the robustness of the proposed SMO method across different initial conditions.

Conclusions:

  • The proposed SMO framework offers a computationally efficient and effective solution for extending 193 nm lithography.
  • The method significantly enhances lithographic performance, particularly in image quality and DOF.
  • The algorithm's robustness and efficiency make it suitable for advanced semiconductor manufacturing processes.