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Effect of Using Electric Current during Dentin Bonding Agent Application on Microleakage under Simulated Pulpal
Naghmeh Gharizadeh1, Azita Kaviani, Samaneh Nik
1Assistant Professor, Department of Operative and Esthetic Dentistry, School of Dentistry, Jundishapour University of Medical sciences, Ahwaz, Iran.
Dental Research Journal
|March 31, 2011
Summary
Applying electric current during etch-and-rinse adhesive application significantly reduced microleakage in dental restorations. This method shows promise for improving the longevity of bonded teeth.
Area of Science:
- Dental Materials Science
- Biomaterials Engineering
- Restorative Dentistry
Background:
- Microleakage is a common issue in dental restorations, potentially leading to secondary caries and pulpitis.
- Etch-and-rinse adhesive systems are widely used, but their clinical performance can be affected by factors like moisture control.
- The application of electric current is an emerging technique to potentially enhance adhesive bonding and reduce microleakage.
Purpose of the Study:
- To investigate the efficacy of using an electric field during the application of a two-step etch-and-rinse adhesive system.
- To determine the effect of electric current on reducing microleakage in dental restorations placed on moist dentin.
- To evaluate a novel experimental device designed for electric current-assisted adhesive application.
Main Methods:
- Sixty human premolars were used, with pulpal pressure simulated at 35 cm H2O.
- Teeth were divided into two groups: one receiving adhesive with electric current, the other without.
- The etch-and-rinse adhesive system (Single Bond) was applied, followed by a dye penetration test to assess microleakage. Data were analyzed using the Mann-Whitney U test.
Main Results:
- The group where the adhesive system was applied with electric current demonstrated significantly lower microleakage scores compared to the control group (P = 0.047).
- A statistically significant reduction in microleakage was observed when electric current was utilized during adhesive application.
- The experimental device effectively delivered an electric field during the adhesive application procedure.
Conclusions:
- The use of electric current during the application of etch-and-rinse adhesive systems can significantly reduce microleakage.
- This finding suggests that electric current application is a promising adjunctive technique for improving the sealing ability of dental restorations.
- Further research is warranted to explore the long-term clinical benefits and optimal parameters for electric current-assisted adhesive bonding.