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Updated: Jun 1, 2026

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Application of a Coupling Agent to Improve the Dielectric Properties of Polymer-Based Nanocomposites
Published on: September 19, 2020
Sequential polymer precipitation of core-shell microstructured composites with giant permittivity
Tingyang Dai1, Kai Chen, Xutang Qing
1Department of Polymer Science and Engineering, State Key Laboratory of Coordination Chemistry, School of Chemistry and Chemical Engineering, Nanjing University, Nanjing 210093, P. R. China.
Macromolecular Rapid Communications
|May 19, 2011
Summary
New sequential precipitation creates polymeric core-shell structures. These composite films exhibit exceptionally high dielectric constants due to conducting cores and insulating shells.
Area of Science:
- Materials Science
- Polymer Chemistry
- Nanotechnology
Background:
- Polymeric core-shell microstructures are crucial for advanced material applications.
- Self-assembly and phase separation are key processes in microstructure formation.
- Controlling morphology is essential for tuning material properties.
Purpose of the Study:
- To develop a novel method for constructing polymeric core-shell microstructures.
- To prepare and characterize poly(vinyldene fluoride)-polycarbonate-lithium perchlorate composite films.
- To investigate the relationship between microstructure and dielectric properties.
Main Methods:
- Sequential precipitation technique for self-assembly and phase separation.
- Preparation of composite films with spherical core-shell morphology.
- Characterization of microstructure and dielectric properties.
Main Results:
- Successful construction of high-quality polymeric core-shell microstructures.
- Composite films consist of conducting cores and insulating shells.
- Observation of exceptionally high dielectric constants (10^4 - 10^7) due to percolation effects.
Conclusions:
- Sequential precipitation is an effective method for creating advanced polymeric microstructures.
- The core-shell morphology significantly influences dielectric behavior.
- These materials show potential for applications requiring high dielectric constants.

