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Fabrication of Low Temperature Carbon Nanotube Vertical Interconnects Compatible with Semiconductor Technology
Published on: December 7, 2015
Carbon-nanotube through-silicon via interconnects for three-dimensional integration
Teng Wang1, Kejll Jeppson, Lilei Ye
1Department of Microtechnology and Nanoscience (MC2) Chalmers University of Technology 412 96 Göteborg, Sweden.
Small (Weinheim an Der Bergstrasse, Germany)
|June 22, 2011
Summary
Mechanical fastening enables carbon nanotube (CNT)-filled through-silicon vias interconnection. This method achieves direct CNT-to-CNT and CNT-to-gold contacts with low specific contact resistances for microelectronic applications.
Area of Science:
- Materials Science
- Electrical Engineering
- Nanotechnology
Background:
- Through-silicon vias (TSVs) are critical for 3D integrated circuits.
- Traditional TSV fabrication methods face challenges in achieving reliable interconnections.
- Carbon nanotubes (CNTs) offer promising electrical properties for advanced interconnects.
Purpose of the Study:
- To demonstrate a novel, easy-to-implement method for interconnecting CNT-filled TSVs.
- To investigate the electrical characteristics of CNT-based contacts within TSVs.
- To assess the feasibility of mechanical fastening for microscale interconnects.
Main Methods:
- Fabrication of TSVs filled with CNTs.
- Implementation of a mechanical fastening process for interconnection.
- Electrical characterization using microprobe measurements.
- Extraction of specific contact resistances for different contact types.
Main Results:
- Successful interconnection of CNT-filled TSVs via mechanical fastening.
- Realization of direct CNT-to-CNT contacts with specific contact resistance of ~1.2 × 10⁻³ Ω cm².
- Realization of direct CNT-to-gold contacts with specific contact resistance of ~4.5 × 10⁻⁴ Ω cm².
Conclusions:
- Mechanical fastening is a viable and simple technique for CNT-filled TSV interconnection.
- The achieved contact resistances are promising for high-performance microelectronic devices.
- This approach offers a scalable solution for advanced 3D integration.
