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Updated: May 31, 2026

The Effect of Interfacial Chemical Bonding in TiO2-SiO2 Composites on Their Photocatalytic NOx Abatement Performance
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Enhanced silicon oxidation on titanium-covered Si(001).

S Ohno1, K Shudo, F Nakayama

  • 1Faculty of Engineering, Yokohama National University, 79-5 Tokiwadai, Hodogaya-ku, Yokohama 240-8501, Japan. sohno@ynu.ac.jp

Journal of Physics. Condensed Matter : an Institute of Physics Journal
|June 29, 2011
PubMed
Summary
This summary is machine-generated.

We studied ultrathin silicon oxide (SiO(x)) formation on titanium-covered silicon. Oxygen exposure created a silicon dioxide layer beneath the titanium oxide, indicating a new interface material. This research is key for understanding thin film growth on silicon surfaces.

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Area of Science:

  • Materials Science
  • Surface Science
  • Solid State Physics

Background:

  • Understanding the initial oxidation of silicon surfaces is crucial for semiconductor device fabrication.
  • Titanium silicide formation is relevant for microelectronics applications.

Purpose of the Study:

  • To investigate the formation of ultrathin silicon oxide (SiO(x)) at the interface of a titanium-covered Si(001) surface.
  • To characterize the chemical states and thickness of the oxide layer formed.

Main Methods:

  • Core level photoemission spectroscopy was employed to study the electronic structure.
  • Analysis of Si 2p core level shifts provided insights into chemical bonding and oxidation states.

Main Results:

  • Oxygen exposure at room temperature formed a SiO(2-δ) layer, near SiO(2) stoichiometry, beneath the titanium oxide film.
  • The ultrathin SiO(2-δ) layer thickness was estimated at approximately 0.9 nm (3-4 oxide layers).
  • Annealing induced further chemical shifts attributed to the formation of titanium silicate (TiSi(x)O(y)).

Conclusions:

  • The study reveals the formation of a distinct silicon oxide layer at the Ti/Si interface during oxidation.
  • The findings highlight the complex interfacial chemistry involving titanium, silicon, and oxygen.
  • The results contribute to the understanding of interfacial reactions in metal-semiconductor systems.