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Updated: May 31, 2026

Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages

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Published on: April 13, 2016

On the implementation of computed laminography using synchrotron radiation.

L Helfen¹, A Myagotin, P Mikulík

¹Institut für Synchrotronstrahlung (ISS/ANKA), Karlsruhe Institute of Technology (KIT), D-76128 Karlsruhe, Germany. lukas.helfen@kit.edu

The Review of Scientific Instruments

|July 5, 2011

Summary

Computed laminography uses synchrotron X-rays for high-resolution 3D imaging of large, flat objects. This technique offers versatile applications in microsystem technology inspection and quality assessment.

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Area of Science:

Materials Science
Physics
Engineering

Background:

Computed laminography is an advanced technique for 3D imaging.
Synchrotron X-rays offer unique properties for high-resolution imaging.
Flat, laterally extended objects present imaging challenges.

Purpose of the Study:

To implement and detail computed laminography using hard X-rays from a synchrotron source.
To demonstrate the capability for high-resolution 3D imaging of large, flat specimens.
To explore the application potential in microsystem technology.

Main Methods:

Utilized hard X-rays from a synchrotron source.
Employed computed laminography principles for 3D reconstruction.
Operated with both monochromatic and white synchrotron beams.
Described experimental setups, alignment, and reconstruction algorithms.

Main Results:

Achieved high spatial resolution down to the micrometer scale for decimeter-sized objects.
Demonstrated optimization for high sensitivity or inspection throughput.
Successfully imaged interconnections in flip-chip and wire-bonded devices.

Conclusions:

Computed laminography with synchrotron X-rays is effective for 3D imaging of large, flat objects.
The method offers high resolution and can be optimized for different experimental needs.
Shows significant potential for 3D inspection and quality assessment in microsystem technology.