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Fabrication of Three-Dimensional Graphene-Based Polyhedrons via Origami-Like Self-Folding

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Published on: September 23, 2018

Depositing graphene films on solid and perforated substrates.

A Banerjee¹, H Grebel

¹Electronic Imaging Center at NJIT and Department of Electrical and Computer Engineering, New Jersey Institute of Technology, Newark, NJ 07039, USA.

|August 11, 2011

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Researchers developed a novel chemical mechanical polishing (CMP) method to deposit large-area, stress-free graphene. This breakthrough addresses the need for efficient graphene deposition for future microelectronic devices.

Area of Science:

Materials Science
Condensed Matter Physics
Nanotechnology

Background:

Graphene, a single layer of graphite, exhibits unique 2D crystallographic properties.
Graphene holds significant promise for next-generation microelectronic devices.
Current deposition methods lack the capability for large-area, monolayer graphene coverage.

Purpose of the Study:

To develop an effective method for depositing large-area, monolayer graphene.
To overcome the limitations of existing graphene deposition techniques.

Main Methods:

Utilized a chemical mechanical polishing (CMP) technique.
Applied CMP for graphene deposition on both solid and perforated substrates.

Main Results:

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Fabrication of Gate-tunable Graphene Devices for Scanning Tunneling Microscopy Studies with Coulomb Impurities

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Achieved deposition of stress-free graphene.
Obtained large area coverage of graphene, extending to hundreds of microns squared.
Demonstrated successful deposition on diverse substrate types.

Conclusions:

The CMP method provides a viable solution for large-scale graphene production.
This technique facilitates the practical application of graphene in microelectronics.
The stress-free nature of the deposited graphene is advantageous for device performance.