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Effect of separating layer thickness on W/Si multilayer replication.

Fangfang Wang1, Baozhong Mu, Huijun Jin

  • 1Laboratory of Advanced Micro-structured Materials, MOE, Institute of Precision Optical Engineering, Department of Physics, Tongji University, Shanghai 200092, China.

Optics Express
|September 22, 2011
PubMed
Summary

Successful replication of W/Si multilayers is achieved using a 1.5 nm platinum separating layer. This method preserves multilayer structure, surface roughness, and reflectivity after replication onto glass substrates.

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Area of Science:

  • Materials Science
  • Nanotechnology
  • Thin Film Technology

Background:

  • Multilayer coatings are crucial for various optical and electronic applications.
  • Replication techniques offer a cost-effective way to transfer thin film structures.
  • Understanding the impact of interface layers on replication fidelity is essential.

Purpose of the Study:

  • To investigate the direct replication of Tungsten/Silicon (W/Si) multilayers.
  • To determine the effect of platinum separating layer thickness on replication performance.
  • To assess structural integrity, surface roughness, and reflectivity post-replication.

Main Methods:

  • Deposition of W/Si multilayers with varying platinum separating layer thicknesses onto supersmooth mandrels using high vacuum DC magnetron sputtering.

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  • Replication of the multilayer structures onto glass substrates via epoxy replication.
  • Characterization using grazing-incident X-ray reflectance and atomic force microscopy.

    • Main Results:

    • W/Si multilayers with platinum separating layers >1.5 nm showed high fidelity after replication.
    • Reflectivity curves before and after replication closely matched theoretical calculations.
    • Surface roughness of replicated samples remained comparable to the original mandrels.

    Conclusions:

    • Direct replication of W/Si multilayers is feasible without compromising structural integrity.
    • A platinum separating layer thickness greater than 1.5 nm is critical for successful replication.
    • The technique allows for the transfer of high-performance multilayer coatings onto diverse substrates.