Surfactant induced symmetric and thermally stable interfaces in Cu/Co multilayers

In this work we studied Ag surfactant induced growth of Cu/Co multilayers. The Cu/Co multilayers were deposited using Ag surfactant by the ion beam sputtering technique. It was found that Ag surfactant balances the asymmetry between the surface free energies of Cu and Co. As a result, the Co-on-Cu and Cu-on-Co interfaces become sharp and symmetric and thereby improve the thermal stability of the multilayer. On the basis of obtained results, a mechanism leading to symmetric and stable interfaces in Cu/Co multilayers is discussed.