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Updated: May 25, 2026

High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods
Published on: December 23, 2013
Bryan L McLaughlin1, Brian Smith, John Lachapelle
1Charles Stark Draper Laboratory, Cambridge, MA 02139, USA.
A new ultra-high density packaging platform enables miniaturized implantable medical devices by interconnecting electronic components at the die-level. This innovation achieves unprecedented packaging densities for advanced medical technology.
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