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Related Experiment Video

Updated: May 25, 2026

High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods
07:51

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Published on: December 23, 2013

Ultra-high density packaging technology for injectable medical devices.

Bryan L McLaughlin1, Brian Smith, John Lachapelle

  • 1Charles Stark Draper Laboratory, Cambridge, MA 02139, USA.

Annual International Conference of the IEEE Engineering in Medicine and Biology Society. IEEE Engineering in Medicine and Biology Society. Annual International Conference
|January 19, 2012
PubMed
Summary

A new ultra-high density packaging platform enables miniaturized implantable medical devices by interconnecting electronic components at the die-level. This innovation achieves unprecedented packaging densities for advanced medical technology.

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Area of Science:

  • Materials Science
  • Electrical Engineering
  • Biomedical Engineering

Background:

  • Future implantable medical devices require significant miniaturization.
  • Die-level electronics miniaturization and packaging are crucial for advanced medical technology.

Purpose of the Study:

  • To propose an integrated ultra-high density packaging platform.
  • To enable a new class of miniaturized medical devices.

Main Methods:

  • Interconnecting existing Application-Specific Integrated Circuits (ASICs) and discrete components.
  • Utilizing a novel process for ultra-high density packaging.

Main Results:

  • Achieved the highest available packaging densities.
  • Created dense modules for medical device applications.

Conclusions:

  • The proposed platform is suitable for developing next-generation implantable medical devices.
  • Ultra-high density packaging is key to advancing medical device miniaturization.