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Related Experiment Video

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Bridging the Bio-Electronic Interface with Biofabrication
16:38

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Chip-scale hermetic feedthroughs for implantable bionics.

Thomas Guenther1, Christopher W D Dodds, Nigel H Lovell

  • 1Faculty of Engineering, Graduate School of Biomedical Engineering, The University of New South Wales, Kensington, NSW 2052, Australia. Thomas.guenther@unsw.edu.au

Annual International Conference of the IEEE Engineering in Medicine and Biology Society. IEEE Engineering in Medicine and Biology Society. Annual International Conference
|January 19, 2012
PubMed
Summary

A new high-density alumina-based feedthrough system was developed for implantable medical devices. This system offers excellent hermeticity and high conductor density, crucial for advanced neuroprosthetic implants.

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Area of Science:

  • Biomedical Engineering
  • Materials Science

Background:

  • Implantable medical devices require hermetic feedthroughs for electronic protection.
  • High channel counts in neuroprostheses necessitate miniaturized, high-density feedthrough technologies.

Purpose of the Study:

  • To develop and characterize a high-density alumina (Al2O3) based feedthrough system.
  • To evaluate the hermeticity and electrical properties of the novel feedthroughs for neuroprosthetic applications.

Main Methods:

  • Fabrication of Al2O3 based feedthroughs with up to 20 platinum conductors per square millimeter.
  • Hermeticity testing using leak detection methods.
  • Measurement of sheet resistance for conductor pathways.

Main Results:

  • Achieved leak rates below 1 × 10(-12) atm × cc/s, surpassing commercial leak detector limits.
  • Demonstrated a sheet resistance of 0.05 Ω.
  • Successfully developed a high-density feedthrough system suitable for neuroprosthetic implants.

Conclusions:

  • The developed Al2O3 based feedthrough system meets the stringent hermeticity and density requirements for advanced neuroprosthetic devices.
  • This technology enables higher channel counts and miniaturization for future implantable neural interfaces.