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Updated: May 25, 2026

Fabrication of Low Temperature Carbon Nanotube Vertical Interconnects Compatible with Semiconductor Technology
Published on: December 7, 2015
Vertically aligned multiwalled carbon nanotubes for pressure, tactile and vibration sensing
O Yilmazoglu1, A Popp, D Pavlidis
1Department of High Frequency Electronics, Technische Universität Darmstadt, Darmstadt, Germany. yilmazoglu@hfe.tu-darmstadt.de
Abstract:
We report a simple method for the micro-nano integration of flexible, vertically aligned multiwalled CNT arrays sandwiched between a top and bottom carbon layer via a porous alumina (Al(2)O(3)) template approach. The electromechanical properties of the flexible CNT arrays have been investigated under mechanical stress conditions. First experiments show highly sensitive piezoresistive sensors with a resistance decrease of up to ∼35% and a spatial resolution of <1 mm. The results indicate that these CNT structures can be utilized for tactile sensing components. They also confirm the feasibility of accessing and utilizing nanoscopic CNT bundles via lithographic processing. The method involves room-temperature processing steps and standard microfabrication techniques.

