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Related Concept Videos

Biasing of Metal-Semiconductor Junctions01:27

Biasing of Metal-Semiconductor Junctions

Biasing metal-semiconductor junctions involves applying a voltage across the junction. Specifically, the metal is connected to a voltage source, while the semiconductor is grounded. This technique is essential for controlling the direction and magnitude of current flow in electronic devices, including diodes, transistors, and photovoltaic cells.
In Schottky junctions, where the semiconductor is n-type, applying a positive voltage to the metal relative to the semiconductor reduces its Fermi...
Metal-Semiconductor Junctions01:24

Metal-Semiconductor Junctions

The contact of metal and semiconductor can lead to the formation of a junction with either Schottky or Ohmic behavior.
Schottky Barriers
Schottky barriers arise when a metal with a work function (Φm) contacts a semiconductor with a different work function (Φs). Initially, electrons transfer until the Fermi levels of the metal and semiconductor align at equilibrium. For instance, if Φm > Φs, the semiconductor Fermi level is higher than the metal's before contact. The semiconductor's...
Biasing of P-N Junction01:16

Biasing of P-N Junction

The operation of a p-n junction diode involves various biasing conditions, including forward bias, reverse bias, and equilibrium.
In equilibrium, no external voltage is applied across the p-n junction. The depletion region is formed at the junction interface due to the diffusion of carriers, which leaves behind charged dopants, acceptors on the p-side, and donors on the n-side. These immobile charges create an electric field that prevents further diffusion of carriers. The related energy band...
MOSFET: Enhancement Mode01:22

MOSFET: Enhancement Mode

Enhancement-mode MOSFETs are pivotal components in electronics, distinguished by their capacity to act as highly efficient switches. They are part of the larger family of metal-oxide Semiconductor Field-Effect Transistors (MOSFETs). They are available in two types: p-channel and n-channel, each tailored to specific polarity operations.
In their basic form, enhancement-mode MOSFETs are typically non-conductive when the gate-source voltage (Vgs) is zero. This default 'off' state means no current...
Non-ohmic Devices00:51

Non-ohmic Devices

In most substances, the current flow is proportional to the voltage applied to it. A simple relationship between the values of current, voltage, and resistance is known as Ohm's law. Nonohmic devices do not exhibit a linear relationship between voltage and current. One such device is the semiconducting circuit element known as a diode. A diode is a circuit device that allows current flow in only one direction.
Consider a simple circuit consisting of a battery, a diode, and a resistor. A diode...

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Related Experiment Video

Updated: May 25, 2026

Measurement of Quantum Interference in a Silicon Ring Resonator Photon Source
12:19

Measurement of Quantum Interference in a Silicon Ring Resonator Photon Source

Published on: April 4, 2017

25 Gbit/s silicon microring modulator based on misalignment-tolerant interleaved PN junctions.

Xi Xiao1, Hao Xu, Xianyao Li

  • 1Optoelectronic System Laboratory, Institute of Semiconductors, Chinese Academy of Sciences, P.O. Box 912, Beijing 100083, China. xixiao@semi.ac.cn

Optics Express
|February 15, 2012
PubMed
Summary

This study demonstrates a high-speed silicon microring modulator with interleaved PN junctions, achieving excellent modulation efficiency and alignment tolerance for optical communication. Its novel doping profile enables robust performance at 25 Gbit/s with low driving voltage.

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Area of Science:

  • Photonics
  • Semiconductor Devices
  • Optical Communications

Background:

  • Microring resonators are crucial for integrated photonics.
  • Efficient and tolerant modulators are needed for high-speed optical networks.

Purpose of the Study:

  • To demonstrate a high-speed silicon microring modulator with enhanced performance.
  • To achieve high modulation efficiency and large alignment tolerance.

Main Methods:

  • Fabrication using standard 0.18 μm complementary metal-oxide-semiconductor (CMOS) processes.
  • Optimization of interleaved PN junctions and doping profiles.
  • Experimental characterization of modulation efficiency, alignment tolerance, and data transmission.

Main Results:

  • Low V(π)L(π) values of 0.68 V·cm to 1.64 V·cm achieved.
  • Modulation efficiency decreased by only 12.4% under ± 150 nm alignment errors.
  • 25 Gbit/s non-return-zero modulation realized with a 4.5 dB extinction ratio at 2 V driving voltage.

Conclusions:

  • The novel doping profile significantly enhances modulator performance.
  • The demonstrated device offers a promising solution for high-speed, cost-effective optical communication.
  • The device exhibits excellent tolerance to alignment errors, simplifying integration.