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Updated: May 24, 2026

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Microfluidic Chips Controlled with Elastomeric Microvalve Arrays
Published on: October 1, 2007
Control of adhesion via internally pressurized subsurface microchannels
Edward Peter Arul1, Animangsu Ghatak
1Department of Chemical Engineering, Indian Institute of Technology, Kanpur, UP, India.
Langmuir : the ACS Journal of Surfaces and Colloids
|February 24, 2012
Summary
This study introduces microchannel-embedded adhesives that allow tunable adhesion. Pressurizing internal channels actively controls the adhesive
Area of Science:
- Materials Science
- Adhesion Science
- Microfluidics
Background:
- Standard pressure-sensitive adhesives (PSAs) rely on viscoelastic glue layers between adherents.
- Existing PSAs lack mechanisms for active control over adhesion properties.
- Microchannel integration offers a novel approach to manipulate adhesive behavior.
Purpose of the Study:
- To investigate the design and adhesive properties of PSAs embedded with microchannels.
- To explore the effect of internal channel pressure on adhesion and debonding hysteresis.
- To determine how channel geometry and surface characteristics influence tunable adhesion.
Main Methods:
- Fabrication of viscoelastic adhesive layers with integrated microchannels.
- Indentation and retraction experiments using a rigid cylindrical indenter.
- Controlled pressurization (positive and negative) of internal microchannels.
- Measurement of adhesion forces and debonding hysteresis during indenter retraction.
Main Results:
- Adhesion hysteresis was observed due to differential debonding loads between the indenter and internal channel surfaces.
- Varying internal channel pressure altered contact areas and significantly modulated adhesion hysteresis.
- Hysteresis peaked at intermediate internal pressures and increased with adhesive skin thickness over channels.
Conclusions:
- Subsurface microchannels provide a method for actively controlling adhesive properties.
- Tunable adhesion is achieved through the interplay of channel design, surface properties, and internal pressure.
- This technology enables large-range manipulation of adhesion for advanced applications.

