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Characterization of SiN Integrated Optical Phased Arrays on a Wafer-Scale Test Station
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3D scanning characteristics of an amorphous silicon position sensitive detector array system.

Javier Contreras1, Luis Gomes, Sergej Filonovich

  • 11CENIMAT/I3N, Departamento de Ciência dos Materiais, Faculdade de Ciências e Tecnologia, FCT, Universidade Nova de Lisboa, 2829-516 Caparica, Portugal.

Optics Express
|March 16, 2012
PubMed
Summary

This study analyzed a 3D scanning system using amorphous silicon position sensitive detectors (PSDs). The system achieved a minimum defect detection of 350 μm and established a relationship between scanning angle and image displacement.

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Area of Science:

  • Optoelectronics
  • 3D Imaging Systems
  • Sensor Technology

Background:

  • Advancements in 3D scanning require precise electro-optical characterization of data acquisition systems.
  • Existing systems may have limitations in defect detection sensitivity and angular scanning flexibility.

Purpose of the Study:

  • To analyze the electro-optical characteristics of a novel 3D scanning prototype.
  • To determine the minimum detectable defect size and explore the impact of scanning angles.
  • To establish the relationship between incident light angle and sensor image displacement.

Main Methods:

  • Utilized a 3D scanning system with a 32-element linear array of 1D amorphous silicon position sensitive detectors (PSDs).
  • Employed the triangulation principle with a sheet-of-light laser for imaging 3D objects.
  • Investigated a range of incident light angles from 15° to 85°.

Main Results:

  • Achieved a minimum detectable gap or simulated defect size of approximately 350 μm.
  • Established, for the first time, the relationship between scanning angle and image displacement on the sensor.
  • Successfully rendered 3D object profiles at a high frame rate across the tested angular range.

Conclusions:

  • The developed 3D scanning system demonstrates effective defect detection capabilities.
  • The study provides crucial insights into optimizing scanning angles for improved 3D imaging performance.
  • The system's ability to render 3D profiles across a wide angular range signifies its potential for diverse applications.