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Surface reactions in microelectronics process technology.

Galit Levitin1, Dennis W Hess

  • 1Georgia Institute of Technology, Atlanta, GA 30332, USA. galit.levitin@chbe.gatech.edu

Annual Review of Chemical and Biomolecular Engineering
|March 22, 2012
PubMed
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Understanding surface reactions is crucial for advancing integrated circuit (IC) manufacturing. This review details key surface reactions impacting microelectronic device fabrication, yield, and performance.

Area of Science:

  • Materials Science
  • Chemical Engineering
  • Electrical Engineering

Background:

  • Integrated circuit (IC) manufacturing involves over 800 steps, with surface reactions critically affecting device yield and performance.
  • Scaling and reliability of electronic devices depend on understanding surface interactions throughout fabrication.

Purpose of the Study:

  • To review critical surface reactions in microelectronic device fabrication.
  • To highlight the importance of surface/interface reactions in developing new materials and processes.

Main Methods:

  • Literature review focusing on surface reactions in IC manufacturing.
  • Selection of key reactions in cleaning, film growth, metallization, and etching.

Main Results:

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  • Surface reactions are fundamental to semiconductor and dielectric film growth.
  • Etching and metallization processes are heavily influenced by surface chemistry.
  • Understanding these reactions is vital for addressing process integration challenges.

Conclusions:

  • Surface reactions are indispensable for the continuous scaling, yield, and reliability of ICs.
  • This review emphasizes the pivotal role of surface chemistry in advancing microelectronics fabrication.