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Optical interconnect transmitter based on guided-wave silicon optical bench.

Po-Kuan Shen1, Chin-Ta Chen, Chia-Chi Chang

  • 1Department of Optics and Photonics, National Central University, Jhongli, Taiwan, 32001, Taiwan.

Optics Express
|April 27, 2012
PubMed
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A novel guided-wave silicon optical bench (GW-SiOB) simplifies intra-chip optical interconnects on silicon-on-insulator (SOI) substrates. This technology enables high-speed data transmission, proving suitable for advanced computing applications.

Area of Science:

  • Photonics and Optical Engineering
  • Integrated Optics
  • Semiconductor Devices

Background:

  • Intra-chip optical interconnects are crucial for high-performance computing, demanding compact and efficient solutions.
  • Silicon photonics offers a promising platform for integrating optical functionalities onto semiconductor chips.
  • Existing solutions for optical interconnects face challenges in miniaturization and integration density.

Purpose of the Study:

  • To demonstrate a novel guided-wave silicon optical bench (GW-SiOB) for simplified and shrunk intra-chip optical interconnects.
  • To validate the performance of the GW-SiOB for high-speed data transmission.
  • To explore the potential of integrated 3D optical paths on silicon-on-insulator (SOI) substrates.

Main Methods:

  • Development of a guided-wave silicon optical bench (GW-SiOB) on a silicon-on-insulator (SOI) substrate.

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  • Realization of three-dimensional guided-wave optical paths using trapezoidal waveguides.
  • Monolithic integration of 45° micro-reflectors for optical path manipulation.
  • Testing of the GW-SiOB transmitter at a data rate of 5 Gbps.

    • Main Results:

    • Successful demonstration of a GW-SiOB on an SOI substrate.
    • Implementation of 3D guided-wave optical paths using integrated trapezoidal waveguides and micro-reflectors.
    • Achieved clearly open eye patterns at a data rate of 5 Gbps, confirming signal integrity.
    • The proposed GW-SiOB effectively simplifies and shrinks intra-chip optical interconnects.

    Conclusions:

    • The demonstrated GW-SiOB is a viable technology for realizing compact and efficient intra-chip optical interconnects.
    • The 3D optical path design using trapezoidal waveguides and micro-reflectors is effective for silicon optical benches.
    • The system's performance at 5 Gbps indicates its suitability for future high-speed optical communication within integrated circuits.