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Accumulation and Analysis of Cuprous Ions in a Copper Sulfate Plating Solution
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Accumulation and Analysis of Cuprous Ions in a Copper Sulfate Plating Solution

Published on: March 20, 2019

Statistical analysis of plating variable effects on the electrical conductivity of electroless copper patterns on

Daniel Zabetakis1, Walter J Dressick

  • 1U.S. Naval Research Laboratory, Center for Bio/Molecular Science & Engineering, Code 6910, 4555 Overlook Avenue S.W., Washington, DC 20375, USA.

ACS Applied Materials & Interfaces
|May 9, 2012
PubMed

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