Leaching studies for tin recovery from waste e-scrap
Manis Kumar Jha1, Pankaj Kumar Choubey, Amrita Kumari Jha
1Metal Extraction and Forming Division, National Metallurgical Laboratory (NML), Jamshedpur 831 007, India. maniskrjha@gmail.com
Waste Management (New York, N.Y.)
|June 1, 2012
Summary
Recycling printed circuit boards (PCBs) recovers valuable tin and lead. An Indo-Korean technique efficiently leaches tin from solder and epoxy resin, enabling safe disposal of metal-free resin.
Area of Science:
- Materials Science
- Environmental Engineering
- Chemical Engineering
Background:
- Printed circuit boards (PCBs) contain valuable and toxic metals, necessitating efficient recycling methods.
- Current recycling processes require optimization for metal recovery and safe disposal of residual materials.
Purpose of the Study:
- To develop and optimize an Indo-Korean recycling technique for waste PCBs.
- To investigate the recovery of tin and lead from PCBs using an organic swelling pre-treatment.
- To evaluate the safe disposal or reuse of metal-free epoxy resin.
Main Methods:
- Bench scale studies were conducted to optimize tin leaching from fresh solder and liberated epoxy resin.
- Parameters varied included acid concentration, temperature, mixing time, and pulp density.
- Kinetics of tin leaching were studied, and lead was removed from leach residue using nitric acid.
Main Results:
- Optimized conditions achieved 95.79% tin leaching from fresh solder using 5.5M HCl at 90°C for 165 min.
- 97.79% tin leaching from liberated epoxy resin was achieved using 4.5M HCl at 90°C for 60 min.
- Sodium stannate was precipitated from leach liquor, and lead was effectively removed from residue.
Conclusions:
- The developed Indo-Korean recycling technique is effective for recovering tin from waste PCBs.
- The process allows for the safe disposal or utilization of metal-free epoxy resin.
- This method contributes to sustainable electronic waste management and resource recovery.
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