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Related Experiment Video

Updated: May 21, 2026

Hybrid Printing for the Fabrication of Smart Sensors
08:35

Hybrid Printing for the Fabrication of Smart Sensors

Published on: January 31, 2019

A high sensitivity three-dimensional-shape sensing patch prepared by lithography and inkjet printing.

Yi-Ren Huang1, Sheng-An Kuo, Michal Stach

  • 1Institute of NanoEngineering and MicroSystems, National Tsing Hua University, Hsin Chu 30013, Taiwan. yrhuangsun@gmail.com

Sensors (Basel, Switzerland)
|June 6, 2012
PubMed
Summary

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A novel manufacturing process combines photolithography and inkjet printing to create high-sensitivity, power-free three-dimensional-shape (3DS) sensing patches for remote deformation detection.

Area of Science:

  • Materials Science
  • Nanotechnology
  • Optical Sensing

Background:

  • Developing high-sensitivity, low-profile sensing patches is crucial for advanced monitoring applications.
  • Existing optical curvature sensors often require power or lack adaptability to diverse substrates.

Purpose of the Study:

  • To propose and demonstrate a hybrid manufacturing process for fabricating three-dimensional-shape (3DS) sensing patches.
  • To evaluate the performance and compatibility of inkjet printing with photolithography for sensor fabrication.

Main Methods:

  • A hybrid approach combining conventional photolithography with novel drop-on-demand (DOD) inkjet printing.
  • Finite Element Method (FEM) modeling based on column buckling and deflection equations to simulate sensor behavior.
  • Interferometer design enabling bi-directional deformation detection.
Keywords:
curvature sensorflexible electronicsinkjet printing

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Last Updated: May 21, 2026

Hybrid Printing for the Fabrication of Smart Sensors
08:35

Hybrid Printing for the Fabrication of Smart Sensors

Published on: January 31, 2019

Planar and Three-Dimensional Printing of Conductive Inks
10:49

Planar and Three-Dimensional Printing of Conductive Inks

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Fabrication of Flexible Image Sensor Based on Lateral NIPIN Phototransistors
09:59

Fabrication of Flexible Image Sensor Based on Lateral NIPIN Phototransistors

Published on: June 23, 2018

Main Results:

  • Successful fabrication of thin (less than 130 μm) 3DS sensing patches with dimensions of 20 × 20 mm².
  • Demonstrated compatibility between DOD inkjet printing and photolithography.
  • FEM simulations validated the sensor's operational principles and predicted performance across curvature ranges of 1.41 to 6.24 × 10⁻² mm⁻¹.
  • The sensor operates remotely without power consumption.

Conclusions:

  • The hybrid manufacturing process offers a viable method for producing high-sensitivity 3DS sensing patches.
  • The developed sensor is a power-free, remotely operable, and versatile alternative to existing optical curvature sensors.