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Related Concept Videos

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Related Experiment Video

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Fabrication of Spatially Confined Complex Oxides
08:45

Fabrication of Spatially Confined Complex Oxides

Published on: July 1, 2013

CMUT Fabrication Based On A Thick Buried Oxide Layer.

Mario Kupnik1, Srikant Vaithilingam, Kazutoshi Torashima

  • 1Edward L. Ginzton Laboratory, Stanford University, Stanford, CA, USA.

Proceedings. IEEE Ultrasonics Symposium
|June 12, 2012
PubMed
Summary

We developed a flexible fabrication process for capacitive micromachined ultrasonic transducers (CMUTs). This method enables versatile designs for single elements, 1D/2D arrays, and reconfigurable arrays with improved reliability and safety.

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Area of Science:

  • Microelectromechanical Systems (MEMS)
  • Ultrasonic Transducer Technology
  • Materials Science

Background:

  • Capacitive Micromachined Ultrasonic Transducers (CMUTs) are crucial for various sensing and imaging applications.
  • Existing fabrication methods often involve complex processes and limited design flexibility.
  • There is a need for a robust and adaptable CMUT fabrication platform.

Purpose of the Study:

  • To introduce a versatile and flexible fabrication process for direct wafer-bonded CMUTs.
  • To enable the creation of single element transducers, 1D and 2D arrays, and reconfigurable arrays.
  • To enhance device reliability and expand the design space for CMUTs.

Main Methods:

  • Utilized direct wafer bonding for CMUT fabrication.
  • Employed a low number of litho masks (five for a 2D array) and standard MEMS tools.
  • Integrated hot electrodes via a buried oxide layer in SOI substrates, connecting to silicon electrodes within CMUT cells.
  • Used vertical insulation trenches for electrode isolation and defined array elements by etching trenches into the handle wafer.

Main Results:

  • Achieved a flexible fabrication platform for diverse CMUT configurations.
  • Demonstrated improved device reliability and a wide design space for operational frequency and geometric parameters.
  • Ensured a continuous front face connected to ground for enhanced signal-to-noise ratio (SNR) and safety.
  • Successfully isolated high electric fields to the evacuated gap region, preventing insulation layer breakdown.

Conclusions:

  • The proposed fabrication process offers a versatile and efficient platform for CMUT development.
  • This method facilitates the creation of advanced CMUT arrays with enhanced performance and safety features.
  • The process is compatible with standard MEMS tools, reducing fabrication complexity and cost.