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Novel temperature dependent tensile test of freestanding copper thin film structures
1KAI Kompetenzzentrum Automobil- und Industrie-Elektronik GmbH, 9524 Villach, Austria.
Abstract:
The temperature dependent mechanical properties of the metallization of electronic power devices are studied in tensile tests on micron-sized freestanding copper beams at temperatures up to 400 °C. The experiments are performed in situ in a scanning electron microscope. This allows studying the micromechanical processes during the deformation and failure of the sample at different temperatures.
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