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Updated: May 20, 2026

Fabrication of Uniform Nanoscale Cavities via Silicon Direct Wafer Bonding
Published on: January 9, 2014
Farizah Saharil1, Carl Fredrik Carlborg, Tommy Haraldsson
1Microsystem Technology, KTH Royal Institute of Technology, Osquldas väg 10, SE-100 44, Stockholm, Sweden. farizah.saharil@ee.kth.se
A new dry wafer bonding method permanently attaches polymer microfluidics to silicon. This click chemistry approach enables efficient, low-temperature fabrication of lab-on-chip devices.
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