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Fabrication of Uniform Nanoscale Cavities via Silicon Direct Wafer Bonding
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Biocompatible "click" wafer bonding for microfluidic devices.

Farizah Saharil1, Carl Fredrik Carlborg, Tommy Haraldsson

  • 1Microsystem Technology, KTH Royal Institute of Technology, Osquldas väg 10, SE-100 44, Stockholm, Sweden. farizah.saharil@ee.kth.se

Lab on a Chip
|July 5, 2012
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Summary

A new dry wafer bonding method permanently attaches polymer microfluidics to silicon. This click chemistry approach enables efficient, low-temperature fabrication of lab-on-chip devices.

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Area of Science:

  • Materials Science
  • Chemical Engineering
  • Biotechnology

Background:

  • Lab-on-chip devices require robust methods for integrating polymer microfluidics with silicon substrates.
  • Existing bonding techniques can be complex, require high temperatures, or lack permanent adhesion.

Purpose of the Study:

  • To introduce a novel, low-temperature dry wafer bonding technique for permanent attachment of polymer microfluidic structures to functionalized silicon.
  • To enable simultaneous fabrication of multiple lab-on-chip devices efficiently.

Main Methods:

  • Utilizing off-stoichiometry thiol-ene (OSTE) polymer microfluidic structures with high surface thiol density.
  • Functionalizing silicon substrates with common bio-linker molecules.
  • Employing "click" chemistry for rapid, covalent bonding between the polymer and substrate.

Main Results:

  • Demonstrated void-free bonding of OSTE microfluidic layers to silane-functionalized silicon wafers.
  • Achieved permanent attachment at low temperatures (< 37 °C).
  • Successfully bonded a batch of microfluidic devices simultaneously.

Conclusions:

  • The novel dry wafer bonding method provides an efficient and permanent solution for fabricating polymer-based lab-on-chip devices.
  • The "click" chemistry approach offers a rapid, low-temperature alternative for microfluidic integration.
  • This technique is suitable for mass production of microfluidic devices.