You might also read
Articles linked to this work by shared authors, journal, and citation graph.
Updated: May 20, 2026

Fabrication of Low Temperature Carbon Nanotube Vertical Interconnects Compatible with Semiconductor Technology
Published on: December 7, 2015
A Schulze1, T Hantschel, A Dathe
1IMEC, Kapeldreef 75, 3001 Leuven, Belgium. Andreas.Schulze@imec.be
We developed a 3D imaging technique using electrical atomic force microscopy to analyze carbon nanotube (CNT) interconnects. This method reveals structural and electrical properties at the nanoscale, crucial for future electronics.
05:04Active Probe Atomic Force Microscopy with Quattro-Parallel Cantilever Arrays for High-Throughput Large-Scale Sample Inspection
Published on: June 13, 2023
08:31Probing Surface Electrochemical Activity of Nanomaterials using a Hybrid Atomic Force Microscope-Scanning Electrochemical Microscope (AFM-SECM)
Published on: February 10, 2021
Area of Science:
Background:
Purpose of the Study:
Main Methods:
Main Results:
Conclusions: