Related Experiment Video
Updated: May 20, 2026
09:20
Fabrication of Low Temperature Carbon Nanotube Vertical Interconnects Compatible with Semiconductor Technology
Published on: December 7, 2015
Ultra-precision engineering in lithographic exposure equipment for the semiconductor industry
1Precision and Microsystems Engineering, Delft University of Technology, Mekelweg 2, Delft 2628CE, The Netherlands. r.h.munnigschmidt@tudelft.nl
Summary
Advancements in wafer scanner positioning systems are crucial for extending Moore's Law in integrated circuit (IC) production. Achieving sub-nanometer accuracy at high speeds requires precise control and minimizing disturbances for future IC manufacturing.
Area of Science:
- Semiconductor Manufacturing
- Nanotechnology
- Precision Engineering
Background:
- Moore's Law dictates doubling integrated circuit (IC) component density every two years.
- Shrinking IC feature sizes necessitate breakthroughs in lithographic tools.
- Wafer scanners are critical exposure systems defining IC details.
Purpose of the Study:
- Review positioning systems in wafer scanners for future Moore's Law extension.
- Address challenges in achieving sub-nanometer accuracy at high velocities.
- Highlight control strategies for reproducible motion systems.
Main Methods:
- Analysis of positioning system requirements for advanced lithography.
- Discussion of feedback and feed-forward control strategies.
- Consideration of environmental and material factors affecting precision.
Main Results:
- Sub-nanometer accuracy and multi-meter-per-second velocities present significant design challenges.
- High-precision model-based feed-forward control is essential.
- Reproducible motion system behavior and disturbance limitation are critical.
Conclusions:
- Mastering atomic-scale material drift is vital for future wafer scanner performance.
- Advanced positioning systems are key to sustaining Moore's Law.
- Technological breakthroughs in control systems enable continued IC miniaturization.
