Acoustic backing in 3-D integration of CMUT with front-end electronics

Sigrid Berg1, Arne Rønnekleiv

  • 1Department of Electronics and Telecommunications, Norwegian University of Science and Technology, Trondheim, Norway. sigrid.berg@iet.ntnu.no

Summary

Capacitive micromachined ultrasonic transducers (CMUTs) require careful substrate design for medical imaging. Fusion bonding is optimal for preventing surface waves, but other methods show promise with thinner layers.

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