Optimized thermal design of new reflex LED headlamp

This paper focuses on the heat dissipation efficiency issues in LED headlamps. The cooling structure is designed and built in Ansys-icepak software based on computational fluid dynamics. During optimized simulation of a single model, geometric parameters, maximum temperature, and thermal resistance are taken as variables, constraint, and objective, respectively. In the case of 85 °C, the optimized model has mass of 0.28 kg, maximum temperature rise of 12.52 °C, and thermal resistance of 1.03 °C/W. During the design of the headlamp, air inlet and outlet are arranged, respectively, taking advantage of airflow generated from the moving auto. The maximum temperature rise is 6.5 °C lower than that in closed case at the speed of 2 m/s.