Electrophoretic deposition of thermites onto micro-engineered electrodes prepared by direct-ink writing

This work combines electrophoretic deposition (EPD) with direct-ink writing (DIW) to prepare thin films of Al/CuO thermites onto patterned two- and three-dimensional silver electrodes. DIW was used to write the electrodes using a silver nanoparticle ink, and EPD was performed in a subsequent step to deposit the thermite onto the conductive electrodes. Unlike conventional lithographic techniques, DIW is a low-cost and versatile alternative to print fine-featured electrodes, and adds the benefit of printing self-supported three-dimensional structures. EPD provides a method for depositing the composite thermite only onto the conductive electrodes, and with controlled thicknesses, which provides fine spatial and mass control, respectively. EPD has previously been shown to produce well-mixed thermite composites which can pack to reasonably high densities without the need for any postprocessing. Homogeneous mixing is particularly important in reactive composities, where good mixing can enhance the reaction kinetics by decreasing the transport distance between the components. Several two- and three-dimensional designs were investigated to highlight the versatility of using DIW and EPD together. In addition to energetic applications, we anticipate that this combination of techniques will have a variety of other applications, which would benefit from the controlled placement of a thin film of one material onto a conductive architecture of a second material.