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Bioelectric Analyses of an Osseointegrated Intelligent Implant Design System for Amputees
Published on: July 15, 2009
Analysis and design of RF power and data link using amplitude modulation of Class-E for a novel bone conduction
Hamidreza Taghavi1, Bo Håkansson, Sabine Reinfeldt
1Department of Signals and Systems, Chalmers University of Technology, 41296 Gothenburg, Sweden. taghavi@chalmers.se
Abstract:
This paper presents analysis and design of a radio frequency power and data link for a novel Bone Conduction Implant (BCI) system. Patients with conductive and mixed hearing loss and single-sided deafness can be rehabilitated by bone-anchored hearing aids (BAHA). Whereas the conventional hearing aids transmit sound to the tympanic membrane via air conduction, the BAHA transmits sound via vibrations through the skull directly to the cochlea. It uses a titanium screw that penetrates the skin and needs life-long daily care; it may cause skin infection and redness. The BCI is developed as an alternative to the percutaneous BAHA since it leaves the skin intact. The BCI comprises an external audio processor with a transmitter coil and an implanted unit called the bridging bone conductor with a receiver coil. Using amplitude modulation of the Class-E power amplifier that drives the inductive link, the sound signal is transmitted to the implant through the intact skin. It was found that the BCI can generate enough output force level for candidate patients. Maximum power output of the BCI was designed to occur at 5-mm skin thickness and the variability was within 1.5 dB for 1-8-mm skin thickness variations.
