Infrared imaging using arrays of SiO2 micromechanical detectors

In this Letter, we describe the fabrication of an array of bimaterial detectors for infrared (IR) imaging that utilize SiO(2) as a structural material. All the substrate material underneath the active area of each detector element was removed. Each detector element incorporates an optical resonant cavity layer in the IR-absorbing region of the sensing element. The simplified microfabrication process requires only four photolithographic steps with no wet etching or sacrificial layers. The thermomechanical deflection sensitivity was 7.9×10(-3) rad/K, which corresponds to a noise equivalent temperature difference (NETD) of 2.9 mK. In the present work, the array was used to capture IR images while operating at room temperature and atmospheric pressure without the need for vacuum packaging. The average measured NETD of our IR detector system was approximately 200 mK, but some sensing elements exhibited an NETD of 50 mK.