A novel method for visualising and quantifying through-plane skin layer deformations.

L-C Gerhardt1, J Schmidt, J A Sanz-Herrera

  • 1Soft Biomechanics and Tissue Engineering, Biomedical Engineering, Eindhoven University of Technology, PO Box 513, 5600 MB Eindhoven, The Netherlands.

Summary

This study introduces a new imaging method to analyze skin deformation, revealing varying strain levels between the epidermis and dermis. This technique quantifies skin mechanics for improved biomechanical models.

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