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Photonic wire bonding: a novel concept for chip-scale interconnects
N Lindenmann1, G Balthasar, D Hillerkuss
1Institute of Photonics and Quantum Electronics (IPQ), Karlsruhe Institute of Technology (KIT), Engesserstr. 5, 76131 Karlsruhe Germany.
Optics Express
|October 6, 2012
Summary
Photonic wire bonding uses 3D polymer waveguides for low-loss chip interconnects. This technology enables high-speed, flexible optical multi-chip systems suitable for mass production.
Area of Science:
- Photonics
- Materials Science
- Optical Engineering
Background:
- Photonic integration demands advanced packaging for 3D, low-loss chip interconnects.
- Current methods face limitations in versatility and scalability for complex configurations.
Purpose of the Study:
- Introduce and demonstrate photonic wire bonding (PWB) as a novel packaging technology.
- Enable low-loss, 3D interconnects between nanophotonic circuits on different chips.
Main Methods:
- Developed polymer waveguides with 3D freeform geometries.
- Fabricated single-mode photonic wire bonds using direct-write two-photon lithography.
Main Results:
- Achieved efficient broadband coupling with average insertion losses of 1.6 dB (C-band).
- Demonstrated capability to carry wavelength-division multiplexing signals at multi-Tbit/s data rates.
Conclusions:
- Photonic wire bonding offers a versatile solution for 3D photonic integration.
- The technology is suitable for automated mass production, promising enhanced optical multi-chip systems.
