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Liquid alloy printing of microfluidic stretchable electronics.

Seung Hee Jeong¹, Anton Hagman, Klas Hjort

¹Department of Engineering Sciences, Uppsala University, Box-534, The Angstrom Laboratory, SE-751 21, Uppsala, Sweden.

|October 6, 2012

Summary

This study introduces a parallel processing method for microfluidic stretchable electronics using stencil printing. The new technology enables cost-effective production of reliable, stretchable electronic devices like RFID tags.

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Area of Science:

Materials Science
Electrical Engineering
Microfluidics

Background:

Microfluidic stretchable electronics are of great interest due to the strain-accommodating properties of conductive liquids.
Current serial processing methods limit throughput and increase costs for complex microfluidic systems.

Purpose of the Study:

To develop a parallel processing technology for fabricating microfluidic stretchable electronics.
To enable cost-effective, high-throughput production of complex stretchable electronic systems.

Main Methods:

Stencil printing of liquid alloy conductors onto semi-cured polydimethylsiloxane (PDMS) substrates.
Assembly of rigid active components and encapsulation with uncured PDMS, followed by curing.
Characterization of printing resolution, conductor resistance under strain, and device reliability through cycling tests.

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Main Results:

Achieved a printing resolution of 200 μm.
Demonstrated linear resistance increase in liquid conductors up to 60% elongation.
A light-emitting diode (LED) circuit maintained stable resistance after 1000 strain cycles.
Successfully fabricated and tested a radio frequency identity (RFID) tag with maintained RF performance.

Conclusions:

The developed stencil printing technology offers a viable parallel processing approach for microfluidic stretchable electronics.
This method facilitates the production of robust and cost-effective stretchable electronic devices.
The technology supports the integration of active components and maintains performance in the radio frequency range.