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Limits to thermal transport in nanoscale metal bilayers due to weak electron-phonon coupling in Au and Cu
1Department of Materials Science and Engineering and Materials Research Laboratory, University of Illinois, Urbana, Illinois 61801, USA. wang302@illinois.edu
Abstract:
Weak electron-phonon coupling in Au and Cu produces a significant thermal resistance when heat flows from a thin Pt layer into a thin Au or Cu layer on picosecond time scales. Metal bilayers (Pt/Au and Pt/Cu) were prepared by magnetron sputter deposition; thermal transport in the bilayers was studied by time domain thermoreflectance in the temperature range 38
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