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Updated: May 15, 2026

Comprehensive Characterization of Extended Defects in Semiconductor Materials by a Scanning Electron Microscope
Published on: May 28, 2016
Quantitative and depth-resolved deep level defect distributions in InGaN/GaN light emitting diodes.
A Armstrong1, T A Henry, D D Koleske
1Sandia National Laboratories, Albuquerque, New Mexico 87185, USA. aarmstr@sandia.gov
Researchers studied deep level defects in Indium Gallium Nitride/Gallium Nitride (InGaN/GaN) light-emitting diodes (LEDs). They found defect concentrations varied with depth, suggesting changing growth conditions influenced their formation within the multi-quantum well region.
Area of Science:
- Materials Science
- Semiconductor Physics
- Optoelectronics
Background:
- Deep level defects in semiconductor devices can significantly degrade performance.
- Understanding defect origins in Indium Gallium Nitride/Gallium Nitride (InGaN/GaN) multi-quantum wells (MQWs) is crucial for efficient light-emitting diodes (LEDs).
Purpose of the Study:
- To investigate and distinguish defect states within the InGaN quantum well and GaN quantum barrier regions of InGaN/GaN LEDs.
- To determine the depth-dependent concentration of these defects.
- To explore the physical origins and impact of these defects on LED performance.
Main Methods:
- Bias-dependent steady-state photocapacitance.
- Deep level optical spectroscopy.
- Capacitance-voltage (C-V) measurements with nanoscale depth profiling.
Main Results:
- Distinct defect states in InGaN quantum wells and GaN quantum barriers were identified.
- Deep level concentrations exhibited strong variations with depth within the MQW region.
- Evidence suggests evolving defect incorporation mechanisms during the MQW growth process.
Conclusions:
- The depth-dependent nature of defects highlights the sensitivity of the MQW growth process.
- Understanding these variations is key to optimizing InGaN/GaN LED fabrication and performance.
- Further research into defect incorporation mechanisms can lead to improved LED efficiency and reliability.
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