Flexible multi-electrode array with integrated bendable CMOS-chip for implantable systems.

Area of Science:

• Biomedical Engineering
• Neurotechnology
• Materials Science

Background:

• Micro-electrode arrays (MEAs) are crucial for neural stimulation and recording in medical and research settings.
• Existing MEAs often lack the flexibility, large area, and high electrode density required for advanced medical implants like brain or retinal prosthetics.

Purpose of the Study:

• To design, manufacture, and characterize a novel flexible MEA with an embedded flexible silicon CMOS chip.
• To address the need for high-density, large-area flexible MEAs for medical implant applications.

Main Methods:

• Design and fabrication of a flexible MEA incorporating a flexible silicon dummy CMOS chip.
• Characterization of the mechanical and electrical properties of the developed flexible MEA.
• Exploration of a bus system for connecting multiple MEAs to increase electrode count and density.

Main Results:

• Successful design and fabrication of a flexible MEA with an embedded CMOS chip.
• Demonstrated potential for significantly increasing electrode number and density through a bus system.
• Characterization data on mechanical and electrical behavior were obtained.

Conclusions:

• The novel flexible MEA with an embedded CMOS chip offers a promising solution for high-density neural interfacing.
• This approach facilitates scalability for advanced medical applications, including brain and retinal implants.
• Further improvements for medical applications are discussed based on this innovative design.