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Bonding of glass nanofluidic chips at room temperature by a one-step surface activation using an O2/CF4 plasma
Yan Xu1, Chenxi Wang, Lixiao Li
1Nanoscience and Nanotechnology Research Center, Research Organization for the 21st Century, Osaka Prefecture University, 1-2, Sakai, Osaka 599-8570, Japan. y-xu@21c.osakafu-u.ac.jp
Abstract:
A technical bottleneck to the broadening of applications of glass nanofluidic chips is bonding, due to the strict conditions, especially the extremely high temperatures (~1000 °C) and the high vacuum required in the current glass-to-glass fusion bonding method. Herein, we report a strong, nanostructure-friendly, and high pressure-resistant bonding method, performed at room temperature (RT, ~25 °C) for glass nanofluidic chips, using a one-step surface activation process with an O(2)/CF(4) gas mixture plasma treatment. The developed RT bonding method is believed to be able to conquer the technical bottleneck in bonding in nanofluidic fields.
