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Updated: May 14, 2026

Preparation of Expanded Chitin Foams and their Use in the Removal of Aqueous Copper
Published on: February 27, 2021
Chitosan nanocomposite films: enhanced electrical conductivity, thermal stability, and mechanical properties
Jason B Marroquin1, K Y Rhee, S J Park
1Department of Mechanical Engineering, Kyung Hee University, 446-701, Seoul, Republic of Korea.
Abstract:
A novel, high-performance Fe(3)O(4)/MWNT/Chitosan nanocomposite has been prepared by a simple solution evaporation method. A significant synergistic effect of Fe(3)O(4) and MWNT provided enhanced electrical conductivity, mechanical properties, and thermal stability on the nanocomposites. A 5% (wt) loading of Fe(3)O(4)/MWNT in the nanocomposite increased conductivity from 5.34×10(-5) S/m to 1.49×10(-2) S/m compared to 5% (wt) MWNT loadings. The Fe(3)O(4)/MWNT/Chitosan films also exhibited increases in tensile strength and modulus of 70% and 155%, respectively. The integral procedure decomposition temperature (IPDT) was enhanced from 501 °C to 568 °C. These effects resulted from a number of factors: generation of a greater number of conductive channels through interactions between MWNT and Fe(3)O(4) surfaces, a higher relative crystallinity, the antiplasticizing effects of Fe(3)O(4), a restricted mobility and hindrance of depolymerization of the Chitosan chain segments, as well as uniform distribution, improved dispersion, and strong interfacial adhesion between the MWNT and Chitosan matrix.
