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Updated: May 13, 2026

Characterization of Thermal Transport in One-dimensional Solid Materials
Published on: January 26, 2014
Thermal and electrical conduction in ultrathin metallic films: 7 nm down to sub-nanometer thickness
Huan Lin1, Shen Xu, Xinwei Wang
1Department of Mechanical Engineering, Iowa State University, 2010 Black Engineering Building, Ames, Iowa 50011, USA.
Abstract:
For ultrathin metallic films (e.g., less than 5 nm), no knowledge is yet available on how electron scattering at surface and grain boundaries reduces the electrical and thermal transport. The thermal and electrical conduction of metallic films is characterized down to 0.6 nm average thickness. The electrical and thermal conductivities of 0.6 nm Ir film are reduced by 82% and 50% from the respective bulk values. The Lorenz number is measured as 7.08 × 10⁻⁸ W Ω K⁻², almost a twofold increase of the bulk value. The Mayadas-Shatzkes model is used to interpret the experimental results and reveals very strong electron reflection (>90%) at grain boundaries.
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