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An elevated temperature study of a Ti adhesion layer on polyimide.

A A Taylor¹, M J Cordill, L Bowles

¹Erich Schmid Institute of Materials Science, Austrian Academy of Sciences, Jahnstraβe 12, A-8700 Leoben, Austria ; Physics Department, Durham University, South Road, Durham, DH1 3LE, UK.

Thin Solid Films

|March 26, 2013

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Heat treatment of titanium films on polyimide reduces adhesion for flexible electronics. This is linked to structural changes in the interfacial layer, impacting circuit reliability and lifetime.

Area of Science:

Materials Science
Surface Science
Polymer Science

Background:

Titanium (Ti) films are crucial for adhesion in flexible electronics, connecting polymer substrates to conductive lines (Cu or Au).
Reliable adhesion is essential for optimal performance and longevity of flexible circuits.

Purpose of the Study:

Investigate the effect of thermal treatment on the adhesion of titanium films on polyimide (PI).
Correlate changes in film structure and interface properties with adhesion performance.

Main Methods:

Fragmentation testing under uniaxial tensile load to assess film adhesion.
Cross-sectional transmission electron microscopy (TEM) to analyze the Ti/PI interface structure.
Buckle dimension analysis using a total energy approach to quantify adhesion.

Keywords:

Adhesion layer Electron microscopy Fragmentation testing Interfaces Temperature Titanium

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Main Results:

Thermal treatment (350 °C or annealing) altered film cracking and buckling behavior compared to as-deposited samples.
Adhesion values decreased significantly after heat treatment.
A ~5 nm thick interfacial interlayer transformed from amorphous to nano-crystalline upon thermal treatment.

Conclusions:

The observed reduction in adhesion is attributed to the structural transformation of the amorphous interfacial interlayer to a nano-crystalline state.
Understanding and controlling this interfacial layer is key to enhancing adhesion and reliability in flexible electronic devices.