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Updated: May 12, 2026
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Metal-Assisted Electrochemical Nanoimprinting of Porous and Solid Silicon Wafers
Published on: February 8, 2022
Resistless nanoimprinting in metal for plasmonic nanostructures
Leo T Varghese1, Li Fan, Yi Xuan
1Birck Nanotechnology Center and School of Electrical and Computer Engineering, Purdue University, Indiana 47907, USA.
Small (Weinheim an Der Bergstrasse, Germany)
|April 23, 2013
Summary
A new resistless nanoimprinting in metal (RNIM) method enables direct patterning of metal nanostructures using silicon molds. This low-cost technique achieves high-resolution, 3D structures for plasmonics and metamaterials applications.
Area of Science:
- Materials Science
- Nanotechnology
- Optics
Background:
- Metal nanostructures are crucial for metamaterials and plasmonics, exhibiting unique properties.
- Existing fabrication methods often require complex processes and resists.
Purpose of the Study:
- To report a novel, resistless method for direct metal nanopatterning.
- To demonstrate the fabrication of high-resolution, 3D metal nanostructures.
Main Methods:
- Resistless nanoimprinting in metal (RNIM) using silicon molds.
- Low pressure (<4 MPa) and temperature (25-150 °C) processing.
- Direct patterning of silver and gold films in a single step.
Main Results:
- Achieved sub-10 nm resolution with smooth, vertical sidewalls in 3D structures.
- Fabricated large-scale vivid images via extraordinary optical transmission.
- Created substrates with strong surface-enhanced Raman scattering (SERS).
Conclusions:
- RNIM offers a simple, widely applicable, and cost-effective approach for fabricating plasmonic nanostructures.
- The method allows for rapid and repeatable production of advanced metal nanostructures.
- Enables new possibilities for metamaterials and plasmonics applications.
